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2023年4月5日发(作者:健康管理师培训班)
Fabricationof5nmlinewidthand14nmpitchfeatures
bynanoimprintlithography
,a),b)HaixiongGe,b)WeiWu,b)MingtaoLi,b)ZhaoningYu,b)
man,,)
DepartmentofElectricalEngineering,PrincetonUniversity,NewJersey08544
(Received10March2004;accepted7May2004;publishedonline17June2004)
Wereportadvancesinnanoimprintlithography,itsapplicationinnanogapmetalcontacts,and
demonstrated5nmlinewidthand14nmlinepitchinresistusing
naicatedgold
contacts(fortheapplicationofsinglemacromoleculedevices)with5nmseparationbynanoimprint
y,theuniformityandmanufacturabilityofnanoimprintovera
eredemonstrated.2004AmericanInstituteofPhysics.[DOI:10.1063/1.1766071]
Thefi-
cationsofnanotechnologyincludesubwavelengthopticalel-
ements,biochemicalanalysisdevices,photoniccrystals,
high-densitysingle-domainmagneticstorage,andsingle-
moleculedevices,,keytothecommercial
successofthesenanotechnologyapplicationsarelowcost
-of-the-
artmanufacturingphotolithographypatterningtoolsareboth
tooexpensiveandincapableofproducingthenecessarypitch
,presently,re-
searchersh黄庭坚书法作品 avebeenlargelyconstrainedtousinglow-
throughputlithographytools,suchaselectron-beamlithog-
raphy(EBL),atomicforcemicroscopy(AFM),andion-beam
h-throughputandlow-costlithography,
various“nanoprinting”technologieshavebeendeveloped.1–3
Here,wereportourinvestigationoftheresolutionlimitof
nanoimprintlithography,wherewedemonstratedananoim-
printrecordof5nmlinewidthfeaturesand14nmpitchover
alargearea,itsapplicationsinnanogapmetalcontacts,anda
studyoffabricationyields.
Inphotocurablenanoimprintlithography(P-NIL)
(showninFig.1),amoldispressedintoalowviscosity
photocurableresistliquidtophysically朱自清散文集25篇 deformtheresist
resistiscuredwithexposuretoUVlight,crosslinkingthe
variouscomponentsintheresistliquid,producingauniform,
disthenseparated
y,ananisotropicreactiveionetch
(RIE)removestheresidualresistinthecompressedarea,
exposingthesubstratesurface.
InordertoexploretheperformanceofP-NIL,avariety
ofmoldswerefabricatedtotestspecificattributes,including
minimumpitch(maximumdensity),minimumfeaturesize,
usly,10nmdots
and40nmpitchhavebeendemonstratedbyNIL1withthe
resolutionlimitedbyourabilitytofabricatethemold,as
proximityeffectsinherentwithEBLmakesub-35nmpitch
patterningverydiffiuceamoldwithapitch
resolutionsurpassingEBLcapabilities,wefabricatedaNIL
moldbyselectivelywetetchingAl
0.7
Ga
0.3
Asfromacleaved
edgeofaGaAs/Al
0.7
Ga
0.3
Assuperlattice[grownby
molecular-beamepitaxy(MBE)]withadilutesolutionof
hydrofluoricacid(HF).4,5Thismoldfabricationprocessof-
fersmanyadvantages,specificallyverydensesub-50nm
pitchtopologiescanbemanufacturedoveralargeareawith
verticalandsmoothsidewalls,lowdefectandlinewidth
variation,andthepitchanddutycyclearecontrollableto
tion,theGaAsmoldhasmultiple
MBEsuperlatticegrowthsofv大团结 aryingpitch,thusallowingus
todeterminetheminimumpitchresolutionofP-NIL.
TheGaAsmoldwaspressedintoaP-NILresistona
transparentquartzsubstrate,andtheresistwasexposedto
UVlightthroughthequartz,curingtheresist,allowingthe
moldtobereleased,leavingtheresistpatternedonthesub-
mprint,thecuredpolymerwassputter-coated
with4nmofIrtoaidinscanningelectronmicroscopy
SEMimaging,however,thermaldamagetothepatterned
structuresbytheSEMelectronbeamlimitedourabilityto
2(a)showsaSEMimage
oftheP-NILpolymerafterimprintwith14nmpitchand
7nmlinewidthpattern,thedensestpatterningwewereca-
pableofconfirmingwithSEManalysisofthepolymer,but
a)Electronicmail:**********************
b)MemberofNanoStructureLaboratory.
ticofthenanoimprintlithographyprocess:(a)Alowvis-
cosityresistfilmispressedwithamoldtocreateathicknesscontrastinthe
ististhenexposedtoUVlight,curingittoproducearigidand
durabletightlybondedpolymernetworkthatconformsthemoldfeatures.
(b)Themoldisseparatedfromthepolymerfilm.(c)Patterntransferusing
anisotropicetchingtoremoveresidueresistinthecompressedtroughs.
APPLIEDPHYSICSLETTERSVOLUME84,NUMBER2628JUNE2004
0003-6951/2004/84(26)/5299/3/$20.002004AmericanInstituteofPhysics5299
ributionsubjecttoAIPlicenseorcopyright,see/apl/
whichmaynotrepresenttheultimateresolutionlimitof
P-NIL.
Figure2(b)showsthetroughsof30and45nmpitch
GaAsmoldsafterimprint,andFig.2(c)thecuredimprinted
P-NILpolymerwiththereproduced30and45nmpitchlines.
Thefidelityofthepatterntransferisexcellentasthelines
extendforseveralhundredsofmicronswithoutdefectsor
variationinwidth,mirroringthetroughsoftheGaAsmold.
P-NILresistadhesiontotheGaAsmoldafterseparationwas
reducedbytreatingthemoldwithanalkanethiolself-
assembledmonolayer(SAM)toreduceitssurfaceenergy.6,7
AsFig.2(b)shows,themoldtroughsareclearofpolyme形容云的诗句 r
residueafterimprint.
Furtherinvestigationoftheminimumsizecapabilityof
P-NILwasperformedwithasiliconwafermoldfabricated
,EBLisadvantageousassparse
smallfeaturescanbereliablypatternedonasiliconsubstrate.
Thesepatternsarethentransferredintothesiliconsubstrate,
asdescribedinRef.1withadryRIEetchproducingamold.
Thesiliconmoldconsistsofnanogapcontactsforpoten-
tialuseastrapsforsingle-moleculeself-assembly,asshown
inFig.3(a).Figure3(b)showsanSEMimageoftheim-
llestfeaturesizeon
themoldof5nmwasreproducedintheresistwithouttear-
wasthesmall-
estfeaturesizeonthemoldobtainablebyEBLpatterning,
theultimateresolutionofP-NILisstillunknown.
Keytothislithographytechnologyisthephotocurable
Ref.3,our
resistwasspin-coated,thusensuringauniformthickness
ontroloverthe
resistthicknessisvitaltomaintainingcontroloverpatterned
cknessofthefilmdependsonthe
molddepth,istconsistsof
multiplecomponentswhoseexactcompositionisproprietary
marycom-
ponentisareactivesiliconcontainingoligomerwhosefunc-
tionistoprovidehighetchresistivitytoanoxygenplasma
RIEetch,andreducesurfaceenergytoaidinmoldsepara-
initiatorcomponentinitiatespolymerization
uponexposuretoUVbyallowingacrosslinkingagentto
formbondswithneighboringreactiveoligomers,thuspro-
latemono-
merprovideshighsolubilityforthevariouscomponents,a
lowviscosityofapproximately100cpbeforecuring,and
preventsshrinkageduringcuring.
TheP-NILresistsolutionisspin-coatedoveratransfer
layerpolymerfilmofpoly(methylmethacrylate)(PMMA)on
nsferlayermaterialcanbevaried
tosuitthespecifi,PMMAwas
chosenforitshighsolubilityinacetoneforalift-offprocess.
TheNILmoldisthenpressedintothelowviscosityP-NIL
resistatroompressure15psiallowingthesolutiontocon-
rizationofthe
P-NILresististhenperformedbyexposingthefilmtoa
broadbandxenonUVlampsource,ensuringadoseof
greaterthan40mJ/xposure,themoldisre-
leased,radhe-
siontothesiliconmoldispreventedbyreducingsurface
energywithafluoroalkyltrichlorosilaneSAM.
Afterseparation,theresidualP-NILpolymerintheim-
printtroughisanisotropicallyetchedwithaRIEplasmaof
CHF
3
andO
2
Ais
FIG.2.(a)Demonstrationofultrahighdensityphotocurablenanoimprint
lithographywithaSEMimageofcuredP-NILpolymerpatternedbyamold
witha14nmpitchgratingwith7nmlinewidth.(b)SEMofaP-NILmold
showing30and45nmpitchtroughs.(c)SEMofcuredP-NILpolymerwith
protruding30and45nmpitchlinescontinuousoverseveralhundredmi-
ineswerefabricatedfromthemoldshownin(b),
clearlyshowingthatnoresiduepolymerremainsinthemoldaftersepara-
tion,andthepatterntransferfidelityishigh.
trationof5nmresolutionphotocurablenanoimprintlithog-
raphywithapplicationforsingle-moleculecontacts.(a)SEMimagesofa
siliconoxidemold.(b)SEMimagesoftheimprintedP-NILresistafterUV
aturesassmallas5nmwerereliably
reproducedintheresist.(c)SEMimagesofAucontactsafterevaporationof
tgapsasnarrowas5nmcanbe
fabricated.
.,Vol.84,No.26,28June2004Austinetal.
ributionsubjecttoAIPlicenseorcopyright,see/apl/
thenetcheddowntothesubstratesurfacewithanO
2
plasma
hselectiv-
ityoftheO
2
plasmatothePMMAovertheP-NILpolymer
isgreaterthan10:strateisnowpatternedwitha
bilayerpolymerfit-
ternedbilayercanbeusedforlift-offapplications,orasan
ethepolymeretch-
ingisatwo-stepprocess,theaspectratioofthepatterned
polymerbilayerfilmcanbegreaterthanthatoftheoriginal
mold.
Next,patterntransferwasdemonstratedwithalift-off
processbyevaporating2nmofCrand12nmofAudirectly
onthesample,andthenremovingthebilayerfilmbydissolv-
rtz
substratewasthenpatternedwithgoldcontactsseparatedby
aslittleas5nm,asshowninFig.3(c).Theyieldsofthegold
contactsexceeded90%provideddustdidnotcontaminate
theprocess.
Fabricationofsub-10nmcontactsofsufficientresolu-
tiontotrapcomplexmacromolecules8willsubstantiallyad-
vancetheemergingfieldofsingle-moleculedevicesbyal-
lowingtherapidproductionofmultiplecontactsinparallel.
Typically,contactsaremadeoneattimewithserialprocess-
ingsuchasAFMprobing,9scanningtunnelingmicroscope
probing,10electromigration,11,12electrochemical桃花源记拼音版原文 growth,13
EBL,14,15trappingcolloidalgoldparticleswithdielectric
force,16orshadowevaporating.17
Finally,westudiedalarge-areaP-NILimprint,anddem-
-
ure4(a)showstheP-NILpatterntransferprocessovera
nwafersubstrateafterthetwo-steppolymerRIE.
Hence,theentirewaferwaspatternedwitha200nmgrating
gesatthecenter,andaroundthe
3-in.-diametercircumferenceshowpatternedpolymeruni-
formitycanbeobtainedovertheentirewaferwithnonotice-
ablevariationincriticaldimension,thickness,sidewall
roughness,4(b)showsahigherreso-
lutionimageofthepolymerbilayerswiththecuredP-NIL
resistontop,ewallsare
almostperfectlystraightduetothehighresistivelyofthe
P-NILresisttotheanisotropicoxygenplasmaetch.
Insummary,wehavedemonstratedthatP-NILisca-
pableof14nmpitchlines,5nmcriticaldimensionfeatures,
nasingle
oimprintprocessisperformedatroomtempera-
tureandrequireslessthan15psipressure,thusallowingfor
awiderangeoftemperature-andpressure-sensitiveapplica-
ayerpolymerfilm,withtheuniquespin-coated
applica蜡炬成灰泪始干比喻什么 tionoftheP-NILresist,ensurestightprocesscontrol
overtheentiresubstrate,aspect-ratioenhancement,no“tear-
off,”
workwillinvolvefurtherdevelopmentoftheP-NILpoly-
mer,deepsub-micronalignmentformultilayerNIL,and
greaterautomationoftheimprintprocess.
ThisworkissupportedinpartbyDARPA.
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wafer:(a)Afterimprintofa200nmperiodgrating,andanisotropicetching,
patternedpolymerbilayershowsnoindicationofvariationincriticaldimen-
sioncontrol,thickness,sidewallroughness,oraspectratio.(b)Ahighmag-
nificationSEMimageofthepolymerbilayer,showingthetopP-NILcured
resist,andunderneath,thetransferpolymerlayer.
.,Vol.84,No.26,28June2004Austinetal.5301
ributionsubjecttoAIPlicenseorcopyright,see/apl/
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